With an aim to further boost its Make in India initiative, the central government will approve multiple semiconductor packaging and fabrication plant proposals in the coming weeks, IT minister Rajeev Chandrasekhar has said.
The Centre reopened the window for fresh fab applications for leading and mature nodes under the modified semiconductor scheme on June 1.
“@GoI_MeitY has reopened the window for fresh fab applications for leading and mature nodes. This is being done since the January 2022 window was closed before the policy was improved to encourage mature nodes with equal incentives,” the Minister said in a tweet.
According to the minister, the government has already approved many semiconductor design companies and received packaging and mature node fab proposals.
“In coming weeks, we expect to approve multiple semiconductor packaging and fab proposals,” the minister said, adding that current and new players may apply afresh in various nodes.
It is to be noted that India recently launched a Rs 76,000 crore production-linked incentive (PLI) scheme for semiconductors and display manufacturing units.
First window for fabrication plants
The first window for 28-nanometer fabrication plants was kept open for 45 days in January 2022 but this window will “open indefinitely.”
“We are now reopening the window for semiconductors, open indefinitely. We are allowing existing applicants to re-apply for more mature nodes,” said Chandrasekhar.
India’s investment in semiconductor design startups
Last month, Prime Minister Narendra Modi-led government allocated Rs 1,200 crore to invest in Indian semiconductor design startups.
According to Chandrasekhar, the government is aiming to create 100 semiconductor design startups in the near future. Their aim will be to develop innovative designs and solutions for the domestic as well as foreign markets.
The minister also said that India will soon have a talent pool of 85,000 highly-skilled professionals in the semiconductor space.
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